Foil copairis becoming increasingly important in chip packaging due to its electrical conductivity, thermal conductivity, processability, and cost-effectiveness. Seo sgrùdadh mionaideach air na tagraidhean sònraichte aige ann am pacadh chip:
1. Tàthadh uèir copar
- Ath-nuadhachadh airson uèir òir no aluminum
- Coileanadh dealain leasaichte: Copper wire bonding offers lower resistance and better thermal conductivity in high-frequency and high-current applications, effectively reducing power loss in chip interconnections and improving overall electrical performance. Mar sin, bidh a bhith a 'cleachdadh foil copar mar stuth còmhraidh ann am pròiseasan ceangailteach agus earbsachd gun chosgaisean a tha a' sìor fhàs.
- Air a chleachdadh ann an dealanan agus meanbh-bhùragan: In flip-chip packaging, the chip is flipped so that the input/output (I/O) pads on its surface are directly connected to the circuit on the package substrate. Thathas a 'cleachdadh foil copair gus electrodes agus meanbh-chthraichean, a tha air an suidheachadh gu dìreach a shoidhnigeadh gu dìreach ris an duilgheadas. Tha an àireamh-aghaidh teirmeach ìosal agus èifeachdailgheadas àrd copair a 'dèanamh cinnteach gun tèid comharran agus cumhachd a dhèanamh.
- Earbsa agus riaghladh teirmeach
- Prìomh stuthan frèam: Foil copairair a chleachdadh gu farsaing ann am pacadh frèam luaidhe, gu sònraichte airson pacadh inneal cumhachd. The lead frame provides structural support and electrical connection for the chip, requiring materials with high conductivity and good thermal conductivity. Bidh FILL copair a 'coinneachadh ris na riatanasan sin, a' lughdachadh chosgaisean pacaidh gu h-èifeachdach fhad 's a tha iad a' leasachadh sgaoileadh teirmeach agus coileanadh dealain.
- Modhan làimhseachaidh uachdar: In practical applications, copper foil often undergoes surface treatments such as nickel, tin, or silver plating to prevent oxidation and improve solderability. Bidh na leigheasan sin a 'cur ri seasmhachd agus earbsachd ann am pacadh frionaidh luaidhe.
- Stuth stiùiridh ann am modalan ioma-chip: System-in-package technology integrates multiple chips and passive components into a single package to achieve higher integration and functional density. Thathas a 'cleachdadh Foil copair gus dèiligeadh ri cuairtean eadar-cheangailte a-staigh agus a' frithealadh mar shlighe gaothrachadh gnàthach. This application requires copper foil to have high conductivity and ultra-thin characteristics to achieve higher performance in limited packaging space.
- RF agus Tagraidhean tonn millimeter-tonn
- Air a chleachdadh ann an sreathan ath-leasaichte (RDL): Ann a bhith a 'pacadh pacaidh, tha foil copair air a chleachdadh gus an còmhdach ath-rianail a thogail, teicneòlas a tha ag ath-riarachadh chip i / o gu sgìre nas motha. The high conductivity and good adhesion of copper foil make it an ideal material for building redistribution layers, increasing I/O density and supporting multi-chip integration.
- Lùghdachadh de mheud agus ionracas soidhne
- Bidh copar a 'dol fodha teasachadh teas agus seanalan cormatal
- Air a chleachdadh ann an TOG-Silicon tro theicneòlas (TSV)
2. Pacaidh flip-chip
3. Pasgan clàraidh luaidhe
4. Siostam-a-steach (SIP)
5. Pacaidh fan-out a-mach
6. RIAGHALTAS TEAGASG AGUS Tagraidhean Cinnidh Teas
7. Teicneòlasan pacaidh adhartach (leithid 2.5d agus pacadh 3D)
Ùine a 'phuist: Sep-20-2024